Aim & Scope
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment. [1]
Continuations / Journal History
| ( 1999 - 2010 ) | IEEE Transactions on Advanced Packaging | ( 2011 - 9999 ) | IEEE Transactions on Components, Packaging, and Manufacturing Technology | |
| ( 1999 - 2010 ) | IEEE Transactions on Components and Packaging Technologies | ( 2011 - 9999 ) | IEEE Transactions on Components, Packaging, and Manufacturing Technology | |
| ( 1999 - 2010 ) | IEEE Transactions on Electronics Packaging Manufacturing | ( 2011 - 9999 ) | IEEE Transactions on Components, Packaging, and Manufacturing Technology |
2024
Novel low-temperature interconnects for 2.5/3D MEMS integration: demonstration and reliability
F Emadi , V Vuorinen , S Liu , M Paulasto-Kröckel
IEEE Transactions on Components, Packaging, and Manufacturing Technology , 2024 , p 1.
D Wang , C Xia , Y Fan , Y Cheng
IEEE Transactions on Components, Packaging, and Manufacturing Technology , 2024 , p 1.
Q Wu , Y Xu , N Liu , ... , Q Liu
IEEE Transactions on Components, Packaging, and Manufacturing Technology , 2024 , p 1.
A pixel-wise segmentation method for automatic X-ray image detection of chip packaging defects
J Wang , G Li , H Bai , ... , X Zhang
IEEE Transactions on Components, Packaging, and Manufacturing Technology , 2024 , p 1.
X Yang , X Huang , L Zhou , ... , J Mao
IEEE Transactions on Components, Packaging, and Manufacturing Technology , 2024 , p 1.
B Xu , Y Cao , B Yuan , ... , G Wang
IEEE Transactions on Components, Packaging, and Manufacturing Technology , 2024 , p 1.
K Hu , Y Zhou , S Sitaraman , M Tentzeris
IEEE Transactions on Components, Packaging, and Manufacturing Technology , 2024 , p 1.
P Vyas , A Alahmer , S Bolanos , ... , S Hamasha
IEEE Transactions on Components, Packaging, and Manufacturing Technology , 2024 , p 1.
Editorial Retractions, Expressions of Concern and External Notices
Solid State Magnetic Field Sensor With Zero Power Consumption
IEEE Transactions on Components, Packaging, and Manufacturing Technology2014 - VOLUME 4, ISSUE 1 pp 86-93.
1 17
3-Axis, Ultrahigh-Sensitivity, Miniature Acceleration Sensor
IEEE Transactions on Components, Packaging, and Manufacturing Technology2018 - VOLUME 8, ISSUE 2 pp 244-250.
0 9